Power chips are connected to external circuits with product packaging, and their efficiency depends on the support of the product packaging. In high-power circumstances, power chips are normally packaged as power components. Chip affiliation refers to the electric link on the top surface area of the chip, which is typically aluminum bonding cable in typical components. ^
Typical power component package cross-section
Currently, commercial silicon carbide power components still mainly use the product packaging technology of this wire-bonded conventional silicon IGBT module. They encounter issues such as big high-frequency parasitical specifications, inadequate heat dissipation capacity, low-temperature resistance, and not enough insulation stamina, which limit making use of silicon carbide semiconductors. The display screen of outstanding efficiency. In order to solve these issues and totally manipulate the significant possible advantages of silicon carbide chips, several brand-new packaging modern technologies and remedies for silicon carbide power modules have arised in recent years.
Silicon carbide power module bonding method
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding products have established from gold cord bonding in 2001 to aluminum cord (tape) bonding in 2006, copper cord bonding in 2011, and Cu Clip bonding in 2016. Low-power gadgets have actually developed from gold cables to copper wires, and the driving force is cost reduction; high-power gadgets have actually developed from light weight aluminum wires (strips) to Cu Clips, and the driving force is to boost item efficiency. The greater the power, the higher the demands.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging procedure that makes use of a solid copper bridge soldered to solder to connect chips and pins. Compared to conventional bonding product packaging approaches, Cu Clip modern technology has the adhering to benefits:
1. The link between the chip and the pins is made from copper sheets, which, to a certain degree, changes the conventional cable bonding technique between the chip and the pins. As a result, an one-of-a-kind plan resistance worth, greater current circulation, and much better thermal conductivity can be acquired.
2. The lead pin welding area does not need to be silver-plated, which can totally conserve the expense of silver plating and bad silver plating.
3. The product appearance is completely consistent with regular products and is primarily made use of in servers, mobile computer systems, batteries/drives, graphics cards, motors, power materials, and other areas.
Cu Clip has 2 bonding methods.
All copper sheet bonding approach
Both the Gate pad and the Resource pad are clip-based. This bonding method is much more pricey and intricate, but it can achieve much better Rdson and far better thermal impacts.
( copper strip)
Copper sheet plus cable bonding technique
The source pad uses a Clip technique, and eviction uses a Cord approach. This bonding technique is a little less expensive than the all-copper bonding technique, saving wafer location (relevant to really small gateway locations). The procedure is easier than the all-copper bonding approach and can acquire much better Rdson and much better thermal result.
Supplier of Copper Strip
TRUNNANOÂ is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding scrap copper, please feel free to contact us and send an inquiry.
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